Embedded Passive Components
Integrated substrates with embedded passives components such as inductors, capacitors, fuses, and resistors. An integrated substrate solution for “Filter” technology.
Embedded Die Fan-out Package
To offer panel level solution of embedded die packaging with the following characteristics
Panel-Level Single die fan-out packaging
Panel-Level Multi-chips packaging
System in package
Multiple Redistributed Layer to fulfil customer’s design requirement
Thick backside Cu (>50um) for better heat dissipation.
Low profile packaging
Cutting-edge low loss material for high frequency deveices
Introducing the low Df material in ACCESS production line to fulfill customer’s demand on high frequency applications.
Ultra-fine Interposer products
To offer Interposer solution with the following ultra-fine design features
Bump of various surface metal finish with pitch of 100um or below.
Bump Pad 50um or below
Via 35um diameter underneath Bump
Fine-Line with 8/8um
To offer various solutions for Cavity in Substrate using unique Pillar technology possessed by ACCESS.
Copper Bump with Various Surface metal finish
Copper Bump with Pitch 100um or below, with various surface metal finish including OSP, ENEPIG, and IT/Tin Plating Cap.
Advanced Digital IC Applications for FCCSP, FCBGA Coreless Substrate
The following design specifications apply to all layers:
Fine Line 15/15um.
Via diameter, 40um or below
Ultra thin Dielectric layer, 25um or below